It explains the pros and cons of epoxy attachment and its advantages over traditional (solder) attachment for ceramic and MLO (multilayer organic) capacitors.
Compared to the vast majority, capacitor attachment via conductive epoxy is not a common technique among end-user applications. A significant amount of growth in capacitor usage has occurred in solder attachment methods.
The selection of a specific conductive epoxy is not simple. At a minimum, epoxy types can be one-part, two-part, or silicone-based. Whichever option is chosen for the “carrier” material, its purpose is to suspend the conductive metal particle in the carrier fluid until they are dispensed and cured.
Terminations compatible with conductive epoxy consist of Ti/W/Au, Ti/W/Ni, AgPd, CuAu, NiAu, ENIG, and ENEPIG. RoHS accepted Sn and SnPb terminated SMT devices are not compatible with conductive epoxy attachment since conductive epoxies absorb water.
Conductive Epoxy attachment is an alternative attachment method of soldering. As the name indicates, a conductive glue replaces solder during the attachment of a device to a PCB (Printed Circuit Board). Devices attached can range from passive components, and semiconductor die to EMI (Electromagnetic Interference) gaskets.
SMT components used in conductive epoxy processes must be compatible with the hydroscopic nature of electrically conductive epoxies. Conductive epoxy attachment offers a very low stress, low-temperature attachment method of creating end circuitry.
MLO Termination options for discrete MLO capacitors and inductors are not compatible with conductive epoxy since they are Sn-based. However, the complex filters have two conductive epoxy compatible terminations – NiAu, and ENEPIG. ENEPIG is short for Electroless Nickel Electroless Palladium Immersion Gold.
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